Membrane Probe-Card Technology (The Future for High-Performance
Wafer Test)
This paper describes the predecessor of today's membrane probes, a critical capability that enables the testing of high pin count ICs at operating speed with performance similar to that obtained by package IC testing. In the paper, two implementations are summarized along with results for several applications. The ability to provide lower cost of ownership due to longer probe lifetime, improved low frequency stability, and lower maintenance costs is discussed.
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